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MOSIS Articles and News
MOSIS News, Articles, and Events

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June 03, 2011
- Mentor Graphics Works with Tezzarron and MOSIS on 3D-IC Prototying Service
- Mentor Graphics Works with Tezzaron and MOSIS on 3D-IC Prototyping Service. [Read all]
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June 22, 2010
- MOSIS, CMP, and CMC Partner to Introduce a 3D-IC Process
- MOSIS, CMP and CMC are partnering to offer a 3D-IC Multi-Project Wafer (MPW) service based on Tezzaron Semiconductor's SuperContact technology and GLOBALFOUNDRIES' 130 nm CMOS process. The first MPW run is targeting January 2011 2-tier face-to-face bonded wafers 130 nm CMOS process for both tiers Top tier exposing TSV and backside metal pads for wire... [Read all]
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October 23, 2009
- Right first time design needs a radical rethink
- Smaller IC feature sizes bring additional problems that are difficult to predict, so why not plan for a re-spin and take advantage of multi-project wafer (MPW) runs? [Read all]
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August 17, 2009
- MOSIS: An Old Idea for Foundry Access Suddenly Sounds Pretty Forward-Looking
- MOSIS, in case you aren't familiar with the organization, is a source of back-end IC production services, from multi-project wafers (MPWs) to small production runs. But it's also much more. The company started out in 1981 providing spots on MPWs for organizations doing research, test chips, samples, or limited production. In those days real men still had fabs, so the customers tended to be... [Read all]
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July 21, 2009
- MOSIS Mixing it Right for Mixed Signal
- While increased choice can only be good, designers need to take care selecting the best process and technology for a specific application. [Read all]
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February 05, 2007
- MOSIS MPW Can Get Chips To Market Quicker
- Customers who use MOSIS MPW services save overhead costs and reduce the time it takes to get their chips to market. [Read all]
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February 01, 2007
- [No Respins] Yes, You Can Just Do It
- The MOSIS Multi-project-wafer (MPW) services is an affordable way to get your design fabricated. [Read all]
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September 15, 2006
- MOSIS And Sempac Announce Low-Cost Alternative To Ceramic Packages
- Customers who use the MOSIS multi-project wafer (MPW) service will be able to access QFN/MLP, QFP and SOIC/SSP packages from Sempac's Open-Pak product line. [Read all]
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September 11, 2006
- MOSIS Reduces The Fabrication Cost To Non-US Customers
- Fabrication costs to non-US companies are now the same as for US companies, plus a small export adder ($500 per project). Packaging costs are unchanged. [Read all]
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August 25, 2006
- GSA (was FSA) Spotlight On MOSIS
- MOSIS has been a member of GSA (was FSA) since 1997. [Read all]

